I've been using Peters Paste #PP-2795 OR SD-2361, OR EQUIVALENT, for all
via-in-pad designs and it works quite well.  I also add the following
statement on the FAB drawing.  " SURFACE TO BE PLANAR PRIOR TO FINAL
PLATING AND METALLIZATION. BOARDS MUST BE SUITABLE FOR VIA IN PAD
TECHNOLOGY".

I hope this helps.

Scott Lefebvre 


-----Original Message-----
From: Wayne Thayer [mailto:[log in to unmask]] 
Sent: Wednesday, June 21, 2006 1:09 PM
Subject: Re: via-in-pad design

Right.  Just specify a non-conductive via fill process.

Wayne Thayer

>>> [log in to unmask] 6/21/2006 4:04 pm >>>
Hi all,
I have a PCB that uses a BRF6150 uBGA (0.5mm pitch) that I need to
redesign.
The current design uses very small blind and buried vias
and the customer want to use through-all vias. The only way I can do
this is
by utilizing a via-in-pad method. Is that still
a good option? maybe used with a via-fill goo?
Thanks
Ken

  _____


Saturn PCB Design
Kenneth J. Wood CID
2737 Bishop Lane
Deltona, Fl 32725
Phone: 407-340-2668
email:  <mailto:[log in to unmask]> [log in to unmask]


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