Hi Badri:
        For most of the components it will not make a difference,
whether eutectic or Pb free solder is used, since the majority of them
are Tin finish, no issues. If it is a BGA it will not solder properly
specially at 63/37 reflow temps due to the fact that the solder balls
for the most part are made with 305 SnAgCu solder, which is not very
compatible with 63/37 SnPb. If the metal finish is Nickel Tin is fine or
if it is Bismuth Tin as long as the Bismuth is =< than 3% is also fine.
So check the metal finish of the part. 
        Regards,	
        Ramon
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Badri
Sent: Thursday, June 22, 2006 7:22 AM
To: [log in to unmask]
Subject: [TN] lead free compatibility

Hello All,

Can I reflow solder a lead free component (chip components)in the leaded
process/profile. Will there be any solderability issue. Advenace thanks
for the help you are rendering.

Thanx
Badri

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