TECHNET Archives

June 2006

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Graham Naisbitt <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Graham Naisbitt <[log in to unmask]>
Date:
Thu, 22 Jun 2006 12:14:51 +0100
Content-Type:
multipart/mixed
Parts/Attachments:
text/plain (1082 bytes) , text/plain (3339 bytes)
Hi Kenny

Clutching at straws here - any chance you have "drilling" residues
before the via is plated?

Can it be something from the via plating operation that has changed?

Have you noticed de-wetting anywhere other than the via's?

Regards
Graham Naisbitt

[log in to unmask]

Phone: +44 (0)12 5252 1500
Mobile: +44 (0) 79 6858 2121


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------



Unit B2, Armstrong Mall Southwood Business Park Farnborough Hampshire GU14 0NR - UK ENGINEERING RELIABILITY IN ELECTRONICS DISCLAIMER : This message is intended only for the use of the individual or entity to which it is addressed and may contain information which is privileged, confidential, proprietary, or exempt from disclosure under applicable law. If you are not the intended recipient or the person responsible for delivering the message to the intended recipient, you are strictly prohibited from disclosing, distributing, copying, or in any way using this message. If you have received this communication in error, please notify the sender and destroy and delete any copies you may have received. Any views or opinions presented in this email are solely those of the author and might not represent those of Gen3 Systems Limited. Although Gen3 Systems Limited has taken reasonable precautions to ensure no viruses present in this email, Gen3 Systems Limited can not accept the responsibility for any loss or damage arising from the use of this email or attachments. On 21 Jun 2006, at 17:16, Bloomquist, Ken wrote: > We are seeing something that we've never noticed before and > wondering if > any of you have seen it and figured out a cure. > > We are hand spray Type UR coating. The boards are very well cleaned > and > dried prior to coating. What we are seeing is a lack of coating on top > of via's. It's most prevalent on small via's, .013" but we're > seeing it > on some of the larger ones as well. When we black light the board you > can see black spots on top of the solder in the via. > > It's not just a thin coating but an actual void area. It's exactly on > the dome of the solder of the via. Our nominal coating thickness is > around .003". > > I sure would appreciate any help on finding a cure for this! > > Thanks, > > KennyB > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following > text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail > to [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/ > archives > Please visit IPC web site http://www.ipc.org/contentpage.asp? > Pageid=4.3.16 for additional information, or contact Keach Sasamori > at [log in to unmask] or 847-615-7100 ext.2815 > ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------

ATOM RSS1 RSS2