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June 2006

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Subject:
Re: via-in-pad design
From:
Wayne Thayer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wayne Thayer <[log in to unmask]>
Date:
Wed, 21 Jun 2006 16:09:29 -0400
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text/plain
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text/plain (54 lines) 
Right.  Just specify a non-conductive via fill process.

Wayne Thayer

>>> [log in to unmask] 6/21/2006 4:04 pm >>>
Hi all,
I have a PCB that uses a BRF6150 uBGA (0.5mm pitch) that I need to
redesign.
The current design uses very small blind and buried vias
and the customer want to use through-all vias. The only way I can do
this is
by utilizing a via-in-pad method. Is that still
a good option? maybe used with a via-fill goo?
Thanks
Ken

  _____


Saturn PCB Design
Kenneth J. Wood CID
2737 Bishop Lane
Deltona, Fl 32725
Phone: 407-340-2668
email:  <mailto:[log in to unmask]> [log in to unmask]


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