After reading all the articles on Lead-Free backwards capability with
Lead-Free BGA's I'm confused.   It is stated that Lead-Free BGA's are
not backwards compatible because of there high temp solder balls not
becoming liquidus when using SnPb solder, the interconnect is considered
too brittle and prone to cracking.  Isn't this true for CBGA's having
the same issue?  Why was it acceptable for CBGA's with SnPb solder but
not for PBGA's?

 

Your thought's 

 

 

 

Scott Lefebvre 


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