Hi TechNetters,



I have a double sided board that uses an ImAg finish. I run one side on one SMT line and the other side on a separate line, but sometimes the second line is being used for other product and may not be available for up to a week. I understand that ImAg tarnishes over time and have also heard that subjecting the board to reflow will speed up the tarnishing process on unsoldered pads. Should I be worried about solderability issues on the second side of my board if I wait a week in between processing the two sides? I am running a no-clean, leadfree process without nitrogen, and the boards reside in a 40% - 50%RH environment.



Thank you, 

Paul Black 

Manufacturing Engineer 

Kronos