Thanks for the answers!

Unfortunately, no straight and clear solutions.

By the way, when talking about design problem I was meaning the design of the circuitry, functional design. There are layout problems also, a few pads are connected to thick traces, but no deformation of the solder ball shows in the X-Rays.

And my english must have failed me again, I wanted to say that I have no idea where the bad joints are, JTAG does not seem to cover all the pins and we cannot pinpoint the failed connections.

Vlad
could you elaborate on why the cross sectioning parallel to the board would be misleading? This is my gut feeling also, but maybe you can put some science to it.

Thanks,

Ioan

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