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June 2006

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Subject:
From:
Lee parker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lee parker <[log in to unmask]>
Date:
Thu, 15 Jun 2006 14:20:48 -0400
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Tom

I am very interested in these proposed specs. Can you send me the proposals?

Thanks

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389


----- Original Message -----
From: "David D. Hillman" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, June 15, 2006 12:08 PM
Subject: [TN] Solderability Specifications Are Out for Ballot


> Hi folks! Hey, just an FYI - the ANSIJ-STD-002C Solderability of
> Components
> and the ANSIJ-STD-003B Solderability of Printed Wiring Boards are current
> out for industry review, comment and ballot. The specifications committees
> have completed a tremendous amount of hard work to produce a set of
> proposed Pbfree solderability testing parameters for industry use. The
> ballot period ends at the end of June - if you would like to
> review/comment/vote on the proposed specifications please contact Tom
> Newton at IPC for a proposed specification/ballot ("Tom Newton"
> <[log in to unmask]>).
>
>
> Dave Hillman
> JSTD-002/003 Chairman
> [log in to unmask]
>
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