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June 2006

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 14 Jun 2006 22:21:43 EDT
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text/plain
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Hi Camille,
Most likely you are correct that /99 or /124 might be adequate for your
application. However, be advised that the impact of the soldering temperatures will
vary widely for the materials falling within these slash sheets.
The STII [Solder Temperature Impact Index] can vary for materials falling
within the various slash sheets as follows:
/26:    <200
/99:    205-230
/124: 202-up
/126: 225-up
/129: 225-up
Experience has shown that STII=205 has LF-capability limited to thin PWBs,
fully LF-capable materials should have STII=>215, nad that advanced LKF-capable
laminates have STII=>240.
A lot of this is discussed in my multi-client study/white paper: "WHITE PAPER
REPORT: Recommendations for PCB FAB Notes and Specifications in Printed
Circuit Board Drawings for SnPb and Lead-Free Soldering Assemblies, the
Qualification of PCB Shops and Activities to Assure Continued Quality."



Werner

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