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June 2006

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Subject:
From:
Wayne Thayer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wayne Thayer <[log in to unmask]>
Date:
Mon, 12 Jun 2006 14:49:10 -0400
Content-Type:
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The "standard" via fill for awhile was DuPont's CB100 silver based
conductive via fill.  The product has both good electrical and thermal
conductivity.  Most apps, though, need neither.  You might think the
conductive via fill could eliminate a plating step, but apparently the
capability to get reliable contact from the via fill material to the
copper is not there at this time.  The CB100 is known for creating
uneven surface finishes in the final product, which I believe is due to
the uneven etching of the material during de-smearing processes.

Over the years, non-conductive via fills have been developed which lead
to more planar surfaces.  And with the price of silver nowadays, the
cost is cheaper.

So I'd recommend you specify non-conductive fill unless you absolutely
must have the thermal or electrical resistance properties the conductive
fills can give you.

Wayne Thayer

>>> [log in to unmask] 6/12/2006 2:40 pm >>>
Technet,

The terms "Conductive" vs "NonConductive" came up in a discussion of a
blind/buried via fab today and these were new terms to me relative to
a
PWB.

Can anyone provide a brief definition of this or point me to something
that explains it in terms of a fab.  Unfortunately, the person that
made
the statement was more of a procurement person that was quoting specs,
but
did not really have an explanation of the requirement or difference.

Is this an industry standard (new) term associate with PWB
requirements,
or is this just something someone used and its been passed on.


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