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June 2006

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Subject:
From:
Graham Naisbitt <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Graham Naisbitt <[log in to unmask]>
Date:
Thu, 8 Jun 2006 18:08:12 +0100
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Hi Roland

We have some data and I will try to dig out the relevant files to
send you.

In essence we found that HASL offers the least favorable SIR values
lead or lead-free.

We are presently finishing a major study of lead-free ENIG, ImSn and
ImAg so might have some better info/data-sets by the end of June.

As to your concerns about OSP, from what you describe I would be more
worried about solderability if the OSP is compromised.

Give me a few days to pull out the info...unless you need urgently?

Graham Naisbitt


On 7 Jun 2006, at 16:50, Roland Jaquet wrote:

> Dear Technetters,
>
> Earlier today I sent an email that for some reason got erased. I
> apologize.
>
> I am wondering if there is some knowledge regarding the surface
> electrical
> insulation / resistance depending on the type of Surface Finishes
> such as
> for the bare PCBs as below:
>
> #1 Electroless Nickel Immersion Gold
> #2 Immersion Tin
> #3 HAL Lead free
> Organic Solderability/Surface Preservative
> Electroplated nickel & gold
> Electroless nickel immersion thick gold
> Immersion Silver
> Electroless  Nickel & Palladium, Immersion Gold
> Hot air solder leveling
> Electroless Thick Gold
> SAC
> (any finishes I am missing here?)
>
> For instance, I am wondering what could be the resistance of an OSP
> finish
> if the contact is such as a feather and flat, versus conical point
> digging
> in?
>
> Anyone met this kind of problem yet?
>
> In our case, we are considering contact less Electrical Test and we
> worry
> about the different issues we could get in with such a process!
>
> Any suggestion?
>
> Thank you
> Best Regards
> Roland
>
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