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June 2006

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Subject:
From:
Roland Jaquet <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Roland Jaquet <[log in to unmask]>
Date:
Thu, 8 Jun 2006 11:53:13 +0200
Content-Type:
text/plain
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text/plain (141 lines)
Thank you Lee,

Are any data available for insulation thickness / resistance of the OSP?

Meilleures salutations
Very Best Regards
Rol@nd

www.PCBspecialist.com
Roland Jaquet
14 Champ Budin
1258 Perly, GENEVA
Switzerland

Tel         +41-22-880-0405
Fax         +41-22-880-0409
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There are three constants in life...
Change, Choice and Principles.
Stephen R. Covey


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee parker
Sent: Wednesday, June 07, 2006 9:47 PM
To: [log in to unmask]
Subject: Re: [TN] Electrical test Failures on Bare Board Finsihes, in
particular OSP

Roland

The real issue may be the ability of the test probe to penetrate the
surface
being tested. In some past studies we found that the probe pressure and pin
type used on HASL boards was inadequate for OSP and gold/nickel boards.
Also
some OSPs present a barrier to the probe that can not be easily overcome
which is why in these cases it is necessary to test the bare board prior to
applying the OSP. If the OSP is not removed in assembly this same barrier
can cause testing difficulties after assembly.

Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389

----- Original Message -----
From: "Roland Jaquet" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, June 07, 2006 11:50 AM
Subject: [TN] Electrical test Failures on Bare Board Finsihes, in
particular
OSP


> Dear Technetters,
>
> Earlier today I sent an email that for some reason got erased. I
> apologize.
>
> I am wondering if there is some knowledge regarding the surface
electrical
> insulation / resistance depending on the type of Surface Finishes such as
> for the bare PCBs as below:
>
> #1 Electroless Nickel Immersion Gold
> #2 Immersion Tin
> #3 HAL Lead free
> Organic Solderability/Surface Preservative
> Electroplated nickel & gold
> Electroless nickel immersion thick gold
> Immersion Silver
> Electroless  Nickel & Palladium, Immersion Gold
> Hot air solder leveling
> Electroless Thick Gold
> SAC
> (any finishes I am missing here?)
>
> For instance, I am wondering what could be the resistance of an OSP
finish
> if the contact is such as a feather and flat, versus conical point
digging
> in?
>
> Anyone met this kind of problem yet?
>
> In our case, we are considering contact less Electrical Test and we worry
> about the different issues we could get in with such a process!
>
> Any suggestion?
>
> Thank you
> Best Regards
> Roland
>
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