Hi Reuven,
You write:

> Its depend if the failure is inside the capacitor or a solder joint
> failure.
> Crack / short / open (inside the caps layers) in such small size of SMT
> caps (for pacemakers), supposed to be a manufacturing failure.
> Solder joint failure - Solder crack, thumb stone, de wetting, shift, etc is
> a PCB design or process failure.
>
Not necessarily. CC cracking is often caused by the soldering process or the
solder itself as a result of thermal shock on cooling and/or too large a
solder fillet.



Werner

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