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June 2006

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Subject:
From:
Graham Naisbitt <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Graham Naisbitt <[log in to unmask]>
Date:
Fri, 23 Jun 2006 15:26:42 +0100
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multipart/mixed
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text/plain (1332 bytes) , text/plain (3524 bytes)
Hi Kenny

Is this a new product or an old one that has only now exhibited tis
problem?

Looking at the photo, I suspect the problem is related to the
reflective UV.

A suggestion, try warming the assembly to around 40DegC then spray
apply the coating. This "trick" can often overcome these issues
because the warmth of the assembly drives off the solvent faster than
the de-wetting forces. Don't make the assembly too hot, or you can
induce bubbles in the coating.

Hope this helps

Kindest regards
Graham Naisbitt

[log in to unmask]

Phone: +44 (0)12 5252 1500
Mobile: +44 (0) 79 6858 2121


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Unit B2, Armstrong Mall Southwood Business Park Farnborough Hampshire GU14 0NR - UK ENGINEERING RELIABILITY IN ELECTRONICS DISCLAIMER : This message is intended only for the use of the individual or entity to which it is addressed and may contain information which is privileged, confidential, proprietary, or exempt from disclosure under applicable law. If you are not the intended recipient or the person responsible for delivering the message to the intended recipient, you are strictly prohibited from disclosing, distributing, copying, or in any way using this message. If you have received this communication in error, please notify the sender and destroy and delete any copies you may have received. Any views or opinions presented in this email are solely those of the author and might not represent those of Gen3 Systems Limited. Although Gen3 Systems Limited has taken reasonable precautions to ensure no viruses present in this email, Gen3 Systems Limited can not accept the responsibility for any loss or damage arising from the use of this email or attachments. On 22 Jun 2006, at 18:38, Bloomquist, Ken wrote: > I've had Steve post a picture of the missing coating on the via's. I > hope this helps make things a little clearer. A picture's worth... > > http://stevezeva.homestead.com/files/Via_Coating_Dewetting.JPG > > Thanks Steve for posting this picture. > > KennyB > > -----Original Message----- > From: Bloomquist, Ken [mailto:[log in to unmask]] > Sent: Thursday, June 22, 2006 9:44 AM > To: [log in to unmask] > Subject: Re: [TN] Conformal Coat Voids > > Hi Ramon, > > These voids have nothing to do with Kapton tape or silicone backed > adhesives. These are via's that are tiny and out in the middle of the > board. There is nothing else around them that is masked. The lack of > coating is only on the domed portion of the solder that is in the via > which protrudes slightly above the board surface. I'll try to get a > picture of the condition if the camera can pick up the black light. > > Thanks, > > KennyB > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following > text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail > to [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/ > archives > Please visit IPC web site http://www.ipc.org/contentpage.asp? > Pageid=4.3.16 for additional information, or contact Keach Sasamori > at [log in to unmask] or 847-615-7100 ext.2815 > ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------

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