Paul

If your environment approaches anything reasonable, you should not have a
problem. As part of the verification process we used, ImAg boards were held
for over a week between the two reflow process and still soldered very well.

Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389

----- Original Message -----
From: "Black, Paul" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, June 19, 2006 11:26 AM
Subject: [TN] ImAg Solderability


> Hi TechNetters,
>
> I have a double sided board that uses an ImAg finish. I run one side on
> one SMT line and the other side on a separate line, but sometimes the
> second line is being used for other product and may not be available for
> up to a week. I understand that ImAg tarnishes over time and have also
> heard that subjecting the board to reflow will speed up the tarnishing
> process on unsoldered pads. Should I be worried about solderability issues
> on the second side of my board if I wait a week in between processing the
> two sides? I am running a no-clean, leadfree process without nitrogen, and
> the boards reside in a 40% - 50%RH environment.
>
> Thank you,
> Paul Black
> Manufacturing Engineer
> Kronos
>

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