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June 2006

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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 28 Jun 2006 13:49:56 -0700
Content-Type:
text/plain
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text/plain (127 lines)
Well I guess one good thing.

With the numbers of emails  I have sent to the commissioner, the commission,
the TAC members and of course the California senate, all with transmission
and read receipts there will be no question of "plausible deniability"
should anyone end up taking the EU to court in the future.....8-)

John

-----Original Message-----
From: Smith, Rick [mailto:[log in to unmask]]
Sent: Wednesday, June 28, 2006 12:28 PM
To: (Leadfree Electronics Assembly Forum); John Burke
Subject: RE: [LF] Draft exemptions additions

Of particular note is item 23, where they propose allowing Pb in parts
with pitches 25 mil or less!!

It's been what, about 20 years ago that suppliers started removing the
lead from the leads of these parts because they gum up the lead-forming
equipment!?

So the TAC acknowledges an industry complaint of tin-whiskers by
allowing lead on the leads of those parts to help reduce whiskers, but
passed the problem on to the component manufacturers to accept reduced
yields at lead-form...

Great strategy.

Rick Smith
Senior Materials & Process Engineer

Phone: (512)652-3544
Fax:     (512)652-3545
Cell:     (512)299-6925
Email:   [log in to unmask]

ClearCube Technology, Inc
8834 Capital of Texas Hwy N
Austin, TX 78759

www.clearcube.com


-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Wednesday, June 28, 2006 1:09 PM
To: [log in to unmask]
Subject: [LF] Draft exemptions additions

Here is the draft of the exemptions list that was approved by the TAC on
their meeting this week. It is draft so presumably not yet written in
stone:



John



ANNEX

In the Annex to Directive 2002/95/EC the following points 21 to 27 are
added:

"21. Lead and cadmium in printing inks for the application of enamels on
borosilicate glass.

22. Lead as impurity in RIG (rare earth iron garnet) Faraday rotators
used
for fibre optic communications systems.

23. Lead in finishes of fine pitch components other than connectors with
a
pitch of 0.65 mm or less with NiFe lead frames and lead in finishes of
fine
pitch components other than connectors with a pitch of 0.65 mm or less
with
copper lead-frames.

24. Lead in solders for the soldering to machined through hole discoidal
and
planar array ceramic multilayer capacitors.

25. Lead oxide in plasma display panels (PDP) and surface conduction
electron emitter displays (SED) used in structural elements; notably in
the
front and rear glass dielectric layer, the bus electrode, the black
stripe,
the address electrode, the barrier ribs, the seal frit and frit ring as
well
as in print pastes.

26. Lead oxide in the glass envelope of Black Light Blue (BLB) lamps.

27. Lead alloys as solder for transducers used in high-powered
(designated
to operate for several hours at acoustic power levels of 125 dB SPL and
above) loudspeakers."




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