Victor,
You did not find what you were looking for because it is not there. And
this was probably done on purpose. There are so many variables - How
thick is your board? What is it made of? How many and where are the
ground planes? How big is the board? What is the spacing of your
components? What is the temperature sensitivity of your parts? Are you
talking tin/lead or lead free? How are you doing the rework - mass
reflow, soldering iron, hot air pencil, rework machine? How well
trained are the people that will be doing the rework? Class 1, 2 or 3
product?
Bev
RIM
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Victor G.
Hernandez
Sent: Monday, June 05, 2006 7:55 AM
To: [log in to unmask]
Subject: [LF] Forced Rework Repair Process Workmanship Acceptance
Fellow TechNetters,
I am searching for associated procedures/documentation and/or standards
regarding the acceptance of 1x, 2x, or 3x Forced Rework Workmanship
Acceptance capability from a vendor. This is not a perfect world so
defects do get repaired. What is the allowable number of components
(SMT, BGA or leaded) that cam be removed from a PCBA on Post soldered
assemblies. What is a typical procedure for this process ie preheat,
dwell time, cleaning etc. I did review IPC-7711A & 7721A but did not
find what I was looking for.
Victor,
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