Registration Reminder...
PCB Fabrication "Back to the Basics" Webcast Series
In this webcast series, we will identify and explain the basics of printed circuit board fabrication. Gain extensive practical knowledge in troubleshooting techniques. You'll learn how to identify the effects of up and down stream processes in the PCB fabrication process, while learning the latest in processing alternatives, and quality control.
Register now and take advantage of this series of webcasts on July 13, 20, and 27, 2006!
July 13, 2006 - 10:00 am - 11:00 am (CT)
Basics of Multilayer
Join us for this first in the "Back to the Basics" series. An overview of materials and resin systems will be provided. Multilayer fabrication in regard to surface preparation and imaging and circuit formation, and innerlayer treatment adhesion promotion is explored. Information on lamination with reference to lay-up, press cycles, post press cycle operation and process effects due to lamination will also be shared.
July 20, 2006 - 10:00 am - 11:00 am (CT)
Via Formation and Metallization
This second webcast in the series will feature via formation with reference to drilling basics, feeds and speeds, drill bit quality and the effect of drilling on hole wall quality. Desmear/etchback with reference to material concerns will also be explored.
July 27, 2006 - 10:00 am - 11:00 am (CT)
Electroplating Technologies
The third webcast in the series will discuss electroplating technologies (i.e., pattern and panel plating), and provide an overview of the plating process and factors affecting plating distribution and throwing power. Don't miss out on this opportunity to learn everything you need to know about the electroplating process!
Click <http://www.ipc.org/calendar/2006/PWB_BasicWebcastSeries_0706/PWBFab_WebcastSeries_706.htm> here for more information on the webcast series.
August 2, 2006 - Bannockburn, IL
Workshop:
Advanced Troubleshooting the PCB Manufacturing Process
The printed circuit board fabrication process is an intricate maze of interrelated steps, both chemical and mechanical. A thorough understanding of each step is critical to minimize or eliminate non-conforming defects, especially defects that increase costs and deter customers. Each process has its own set of variables affecting the performance of the finished product.
In this course, we will identify and explain these variables, along with the consequences of not properly controlling these processes. Plated-through hole voids, poor solderability, hole wall pullaway, mouse bites, and delamination are just a few defects that we will cover so that you can manage the fabrication process effectively. We will review hundreds of slides showing microsection defects and discuss how they were caused and how to correct them.
Gain extensive practical knowledge in troubleshooting techniques. You'll learn how to identify the effects of up and down stream processes in the PCB fabrication process, while learning the latest in processing alternatives, process and quality control.
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