Right. Just specify a non-conductive via fill process.
Wayne Thayer
>>> [log in to unmask] 6/21/2006 4:04 pm >>>
Hi all,
I have a PCB that uses a BRF6150 uBGA (0.5mm pitch) that I need to
redesign.
The current design uses very small blind and buried vias
and the customer want to use through-all vias. The only way I can do
this is
by utilizing a via-in-pad method. Is that still
a good option? maybe used with a via-fill goo?
Thanks
Ken
_____
Saturn PCB Design
Kenneth J. Wood CID
2737 Bishop Lane
Deltona, Fl 32725
Phone: 407-340-2668
email: <mailto:[log in to unmask]> [log in to unmask]
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