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June 2006

DesignerCouncil@IPC.ORG

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DesignerCouncil <[log in to unmask]>
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Thu, 29 Jun 2006 10:22:10 -0700
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"(Designers Council Forum)" <[log in to unmask]>, Silicon Valley Chapter - IPC <[log in to unmask]>
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Silicon Valley Chapter - IPC <[log in to unmask]>
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Silicon Valley Chapter of the IPC Designers Council

  Next Meeting is Tuesday, July 11  (11:30AM to 1:30PM)
    The Beverly Heritage Hotel
  (Santa Clara Room)

    1820 Barber Lane
Milpitas, CA 95035

    408-943-9080

    http://www.beverlyheritage.com/


  Sponsored by Zuken
  http://www.zuken.com
  Lunch will be a deli buffet
  RSVP to [log in to unmask]
  ~  ~  ~  ~  ~  ~  ~  ~  ~  ~

  Speaker:  Gil White
  Technical Marketing Manager
  DDI  -  Anaheim, California

  During the past 28 years, I have worked in the area of Electronic Interconnect, including Design, Fabrication, and Materials for electronic substrate.  This includes MCM, BGA, and Flip Chip interposers & substrate, as well as Rigid, Flex, and Rigid-Flex PCBs.  Education includes Electrical Engineering  (BSEE) and a MBA with emphasis on Technology Management.   Additionally, I have provided Technical Seminars in 14 countries within North America, Asia, Europe, and the UK.

  Primary Topic:
  • Embedded Capacitance
  &#56256;&#56510; Definition - Materials & attributes
  &#56256;&#56510; Design Guidelines & Constructions
  • Embedded Resistance
  &#56256;&#56510; Definition - Materials & attributes
  &#56256;&#56510; Design Guidelines & Constructions

  Secondary Topic (If time available)
  • BGA Design Guidelines IPC Class 2 & 3
  &#56256;&#56510; Hole-to-copper – Standard & Advanced
  &#56256;&#56510; Drill diameter-to-pad diameter requirements
  &#56256;&#56510; Drill to Pad to Aspect ratio requirements
  &#56256;&#56510; Tracks per Channel & Trace & Space
  &#56256;&#56510; Anti-Pad for plane clearance
  &#56256;&#56510; 1.27 mm, 1 mm, 0.8 mm, 0.65 mm, 0.5 mm, & 0.4 mm
  &#56256;&#56510; BGA off-Set Microvias



  Please RSVP by July 7
  Send to [log in to unmask]



  ~  ~  ~  ~  ~

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