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Date: | Fri, 16 Jun 2006 09:05:30 -0400 |
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Hi,
first it was the cracked capacitor question, thanks to all who answered.
Now I have another one on the ethernal dilemma: is the BGA poorly soldered or there is a design issue?
The question is: how can I assess whether the BGA that fails test is properly soldered? I do not have a 5DX and whatever I can see with the Ersascope looks OK. Needless to say, I cannot get the location of the failed pin.
Will cross sectioning parallel to the surface of the board tell me anything?
Can this be done? Any particularities regarding the polishing of the surfaces?
What to look for?
Thanks,
Ioan
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