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Date: | Thu, 4 May 2006 13:44:34 +0200 |
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IPC-J-STD-020 is about Classification, I think you need IPC-J-STD-033 - "Handling, Packing, Shipping and use of Moisture/Reflow Sensitive Devices
Also avaible on JEDEC's website
Keld Maaløe
Quality Engineer
bb electronics manufacturing a/s
DK 8700 Denmark
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Daniel Blass
Sent: 3. maj 2006 21:08
To: [log in to unmask]
Subject: Re: [TN] BGA problem
Popcorning and delamination of plastic IC packages in reflow assembly is
covered by an IPC/JEDEC standard, IPC/JEDEC J-STD-020C, "Moisture/Reflow
Sensitivity Classification for Nonhermetic Solid State Surface Mount
Devices". This standard is available free on JEDEC's website.
http://www.jedec.org/download/search/jstd020c.pdf
Daniel Blass
Process Research Engineer
Area Array Consortium
Surface Mount Technology Lab
Universal Instruments Corporation
http://www.uic.com/wcms/WCMS2.nsf/index/Global_Svc_Support_31.html
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