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May 2006

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Subject:
From:
Michael Forrester <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 4 May 2006 06:00:38 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (52 lines)
We have some right angle SMT fine pitch butt joint two row connectors that
due to excessive
force placed on them have caused cracks in the solder joint.  We have
worked out the mech. issue to relieve
the pressure.  I have some joints that just show a crack in the joint and
others that there is a clear break.  Each
connector is $7.00 ea.  and we have seen this on~100 connectors.  My
questions are the following:

      1)  The original thinking was we could just use our BGA rework
machine to blow hot air on the cracked
            joints, remelt the solder and the joint would be good again.
But then do I have to worry about
            a possible lead coplanar problem?  Since I'm reflowing the
entire connector will that really be
            an issue or the damage is done and the leads that are cracked
are now "bent" and I need
            to worry about it?

      2) Would the answer to the above question change for different
senecios:

            a) Entire row has a clear break
            b) Only a few solder joints are cracked (out of 50) but no
clear break
            c) Only a few solder joints are cracked but some have a clear
break

      3) The connectors are in a row of 5, should I also reflow connectors
that do not show any sign of
            cracks, even thou other connectors in the row have cracks?  The
assumption is that the
            parts that are not cracked have seen the same stresses as the
ones with cracks.

      Thank you as always.

Best Regards,

Mike Forrester
LeCroy Corporation

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