TECHNET Archives

May 2006

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Daniel Blass <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Daniel Blass <[log in to unmask]>
Date:
Wed, 3 May 2006 15:47:20 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (26 lines)
Dave,

The following paper has wetting balance data at 245°C and 260°C.  This
should give you a ballpark figure for 255°C.

http://xmembers.ipc.org/IPCLogin/IPCMembers/IPC/Review/1105/Nov2005ReviewTechPap.pdf

Regards,

Dan Blass
Process Research Engineer
Area Array Consortium
Surface Mount Technology Lab
Universal Instruments Corporation
http://www.uic.com/wcms/WCMS2.nsf/index/Global_Svc_Support_31.html

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2