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May 2006

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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Burke <[log in to unmask]>
Date:
Wed, 3 May 2006 08:59:21 -0700
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Drill a hole in the top, attach a thermocouple to the silicon. You
should be ramping at around 3 degrees C per second, and the top profle
temperature on that thermocouple should be peaking at 218 Centigrade
assuming you are using regular leaded solder.

If you are not, you might want to share the alloy and thermal profiles
with us along with the bake out times before aseembly, temps etc,.

John

John Burke
Senior Manager - Operations , Optichron
[log in to unmask]
W: 510 249 5233
M: 408 515 4992
http://www.optichron.com
Profile: https://www.linkedin.com/e/fps/2665502/

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Azman
Sent: Wednesday, May 03, 2006 6:47 AM
To: [log in to unmask]
Subject: [TN] BGA problem

Hi TechNet members,

I have one issue that I encountered recently whereby my BGA has warped
after reflow. Please see attached link below to see how does the warped
BGA
look like. The BGA type is FPBGA and my reflow profile is OK. Your input
and comment is greatly appreciated to help me solve this issue.

http://img72.imageshack.us/my.php?image=bgawarp9ot.jpg

Regards,

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