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May 2006

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Subject:
From:
"Tempea, Ioan" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tempea, Ioan
Date:
Wed, 3 May 2006 09:59:06 -0400
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text/plain (47 lines)
Azman,

what you have is not warpage, but delamination. This means that the BGA, being a moisture sensitive device, had too much moisture inside and it got delaminated during reflow.

You will get all the details you need in J-STD-033 and J-STD-020, available at http://jedec.org/download/default.cfm

Regards,
Ioan

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Azman
Sent: Wednesday, May 03, 2006 9:47 AM
To: [log in to unmask]
Subject: [TN] BGA problem


Hi TechNet members,

I have one issue that I encountered recently whereby my BGA has warped
after reflow. Please see attached link below to see how does the warped BGA
look like. The BGA type is FPBGA and my reflow profile is OK. Your input
and comment is greatly appreciated to help me solve this issue.

http://img72.imageshack.us/my.php?image=bgawarp9ot.jpg

Regards,

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