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May 2006

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Subject:
From:
"Barmuta, Mike" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Barmuta, Mike
Date:
Tue, 2 May 2006 14:38:25 -0700
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text/plain
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text/plain (84 lines)
Barry: In regards to plating.

Thieving: Features placed on the outerlayer of the board to balance the
plateable surface area, producing uniform current distribution during
electroplating. Thus providing a consistent plating thickness across the
board and in the holes.

	
Regards
	
Michael Barmuta
	
Staff Engineer
	
Fluke Corp.
	
Everett WA
	
425-446-6076
	


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Barry Gallegos
Sent: Tuesday, May 02, 2006 2:22 PM
To: [log in to unmask]
Subject: [TN] Thieving

Good day T'Netters.
Am looking for a definition of Thieving when applied to PCB fabs.


Thank you in advance

Barry

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