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May 2006

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Subject:
Re: Electrolytic Ni/Au in DES
From:
Lin Leo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lin Leo <[log in to unmask]>
Date:
Thu, 1 Jun 2006 12:15:26 +0800
Content-Type:
text/plain
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text/plain (82 lines) 
Thanks for your advice!


  Leo




Denis Morrissey <[log in to unmask]> 弧
  Leo,

While the gold itself should not be attacked by cupric chloride etching, it
is fairly porous at 12-20 microinches. I would expect the underlying nickel
to be attacked substantially. Ammoniacal final etch is the etch of choice
for this finish.

Regards,

Denis Morrissey
Senior Manager- Wet Process Engineering
Tel: (631) 845-1041 EXT: 18
Fax: (631) 501-1270
[log in to unmask]



-----Original Message-----
From: Lin Leo [mailto:[log in to unmask]]
Sent: Saturday, May 27, 2006 3:25 AM
Subject: Electrolytic Ni/Au in DES

Hi,

Does anyone have experience on electrolytic Ni/Au(Au thickness: ca. 12~20
micro-incheses; Hard gold Au-Co alloy) acting as etching resist in
DES(developing-CuCl2/HCl-stripping) process? Does Au thickness have impact
on etching solution attack?

Thanks

Leo


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