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May 2006

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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Burke <[log in to unmask]>
Date:
Tue, 30 May 2006 15:01:22 -0700
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text/plain (117 lines)
Cool but just to reference 3D X-ray systems

There are 3 types of systems:

The 5Dx type system - this will generally not find co-planar cracks as it is
slicing in 3 to 5 places horizontally depending on the set up, board bow
etc.

Then there are the new hi res 3D x-ray systems which are generally driven by
an operator who knows that they are doing, I have (once) found a co-planar
crack using these.

Then there are the gazillion dollar amazing resolution 3D computer modeling
systems which I was referring at the 4K set up charge. I am trying to get
the details of where I had that done and will  mail you when I find out.

John

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Tuesday, May 30, 2006 2:44 PM
To: TechNet E-Mail Forum; John Burke
Subject: Re: [TN] solder ball analysis

John, et. al.

Thanks for the various suggestions.  We have had some experience with "3D
XRay"
systems in the past and will try it out on our solder ball joints.  I will
share the results
with the net if we learn anything noteworthy.

Andy






John Burke <[log in to unmask]> on 05/30/2006 12:59:56 PM

Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to
      John Burke <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: Andrew Shieh/CSP)
Subject:  Re: [TN] solder ball analysis




I used that type of system and it will definitely find the issues,
particulary useful on a co-planar defect at the boards interface.

I used this system 2 years ago up north of San Francisco I think, it cost
about $4000 for the set up plus about the same for the shots, but the
results were incredible, you can literally "fly" through the 3D Xray using
the software.

If needed I wil dig up th company and details of the people and send off
line.

John

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent: Tuesday, May 30, 2006 8:29 AM
To: [log in to unmask]
Subject: Re: [TN] solder ball analysis

When you are looking at the balls on the BGA for this analysis, what
features are you looking to find?  Crack? Opens? Unsoldered balls?  I  know
that
Micro-CT imaging can get down to sub-micron feature sizes in  3-D.  Does
that get
you the detail you need?

Jon Moore

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