John, et. al.

Thanks for the various suggestions.  We have had some experience with "3D
XRay"
systems in the past and will try it out on our solder ball joints.  I will
share the results
with the net if we learn anything noteworthy.

Andy






John Burke <[log in to unmask]> on 05/30/2006 12:59:56 PM

Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to
      John Burke <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: Andrew Shieh/CSP)
Subject:  Re: [TN] solder ball analysis




I used that type of system and it will definitely find the issues,
particulary useful on a co-planar defect at the boards interface.

I used this system 2 years ago up north of San Francisco I think, it cost
about $4000 for the set up plus about the same for the shots, but the
results were incredible, you can literally "fly" through the 3D Xray using
the software.

If needed I wil dig up th company and details of the people and send off
line.

John

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent: Tuesday, May 30, 2006 8:29 AM
To: [log in to unmask]
Subject: Re: [TN] solder ball analysis

When you are looking at the balls on the BGA for this analysis, what
features are you looking to find?  Crack? Opens? Unsoldered balls?  I  know
that
Micro-CT imaging can get down to sub-micron feature sizes in  3-D.  Does
that get
you the detail you need?

Jon Moore

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------