I used that type of system and it will definitely find the issues,
particulary useful on a co-planar defect at the boards interface.

I used this system 2 years ago up north of San Francisco I think, it cost
about $4000 for the set up plus about the same for the shots, but the
results were incredible, you can literally "fly" through the 3D Xray using
the software.

If needed I wil dig up th company and details of the people and send off
line.

John

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent: Tuesday, May 30, 2006 8:29 AM
To: [log in to unmask]
Subject: Re: [TN] solder ball analysis

When you are looking at the balls on the BGA for this analysis, what
features are you looking to find?  Crack? Opens? Unsoldered balls?  I  know
that
Micro-CT imaging can get down to sub-micron feature sizes in  3-D.  Does
that get
you the detail you need?

Jon Moore

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