Hi Richard
I wish I had an expert opinion on this one.  The rigid board group is trying
to identify what tests are being used by people who buy boards to determine if
the boards will withstand the elevated temp of Lead-Free.  So far the
consensus has indicated a new test needs to be developed that involves multiple
passes through IR reflow.  What the parameters would be is still up for grabs.

The Thermal Stress test, as far as I am aware of, has been able to weed out
infant mortality of "regular" boards used in current surface mount and wave
soldering processes.

All bets are off when it comes to the extended times and temperatures
required to accomodate all of the combinations of leaded and lead free assembly
processing.

Any and all recommendations would be appreciated as the 6012 group states
this investigation as to what is needed.

Susan Hott
Robisan Lab

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