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May 2006

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Subject:
From:
Andrew Shieh <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 30 May 2006 12:11:20 -0400
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text/plain
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Hi Jon,

My application is when we encounter an open in a net containing one or more
of these
entombed solder balls.  We usually can isolate a fault down to a single net
through our
diagnostics.  We can electrically test the PCB or BGA once we remove the
BGA, but this
destroys any evidence of the root cause if the problem was in the solder
joint.  I am
more concerned about cracks and other types of defects in the solder joint.
I guess that
this could include unsoldered balls (solder paste application defect) and
insufficiently
melted solder balls (assembly process defect).  If the problem is a solder
joint defect,
our goal is to understand enough of the source of the defect to determine
the extent
of any latent problems in the field and work to prevent similar problems in
the future.

Thanks.

Andy







[log in to unmask] on 05/30/2006 11:29:12 AM

Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to
      [log in to unmask]

To:   [log in to unmask]
cc:    (bcc: Andrew Shieh/CSP)
Subject:  Re: [TN] solder ball analysis




When you are looking at the balls on the BGA for this analysis, what
features are you looking to find?  Crack? Opens? Unsoldered balls?  I  know
that
Micro-CT imaging can get down to sub-micron feature sizes in  3-D.  Does
that get
you the detail you need?

Jon Moore

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