Leo,

While the gold itself should not be attacked by cupric chloride etching, it
is fairly porous at 12-20 microinches.  I would expect the underlying nickel
to be attacked substantially.  Ammoniacal final etch is the etch of choice
for this finish.  

Regards,
 
Denis Morrissey
Senior Manager- Wet Process Engineering
Tel:  (631) 845-1041 EXT: 18
Fax: (631) 501-1270
[log in to unmask]

 

-----Original Message-----
From: Lin Leo [mailto:[log in to unmask]] 
Sent: Saturday, May 27, 2006 3:25 AM
Subject: Electrolytic Ni/Au in DES

Hi,

  Does anyone have experience on electrolytic Ni/Au(Au thickness: ca. 12~20
micro-incheses; Hard gold Au-Co alloy) acting as etching resist in
DES(developing-CuCl2/HCl-stripping) process?  Does Au thickness have impact
on etching solution attack?

  Thanks

  Leo


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