Thanks for confirming what you are actually doing in this test.  We have come
up against the two different styles and have had trouble correlating results.
 By dipping the process simulates a Hot Air Solder Leveling process.  All of
the stresses are equal since both "sides" of the board see the same heat at
the same time.  The float has a really hot bottom and a relatively cool top.
This allows (causes) z-axis expansion that weeds out both barrel cracks and
inner layer separations.

There are no IPC test methods that call for dipping other than the
solderability tests.

Thanks again for the clarification

Susan

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