Steve,

As a plater, I would say that a .4 mil plating range across a pattern plated
panel is probably not possible in the real world.  You might do better with
panel plate/tent and etch.  The high frequency world handles this by
selectively plating only the holes and pads, and not the traces.  This way
you only need to worry about the variation in the foil, which may not be as
tight as +/- .2 mil anyway.

Regards,

Denis Morrissey
Senior Manager- Wet Process Engineering
Tel:  (631) 845-1041 EXT: 18
Fax: (631) 501-1270
[log in to unmask]




-----Original Message-----
From: Steve Kelly [mailto:[log in to unmask]]
Sent: Thursday, May 25, 2006 10:17 AM
Subject: Copper plating question

Good Day To All,
I have a copper plating distribution question. Is it possible to hold the
pattern copper plating thickness to +/-.0002 across a panel. Anyone want to
venture what kind of Cp and Cpk they might hold? Thanks in advance. Steve
Kelly

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