I wouldn't lead my customers to believe this is feasible.

Thank you,
Eddie Rocha



Hi Steve: Well; it depends...........

First: I'm going to assume you are using inches as the
units for
thickness.
Second: You are not concerned about the uniformity of
plating in the
holes vs. surface.

With that said the +/-0.0002 can be done but there are many
factors that
will influence it:

*       Design
*       Panel size
*       Outer-layer circuit layout
*       Uniformity of layout across the panel
*       Plating robbers
*       Plating thickness

*       Process
*       Rectification
*       Current density
*       Plating time
*       Anode distribution
*       Anode/cathode ratio
*       Anode maintenance
*       Plating rack material/design/attachment
*       Plating bath agitation
*       Plating tank size/design
*       Plating bath chemistry
*       Plating bath maintenance

        There are other factors but you get the idea. The
goal is to
create a uniform current distribution across the panel.



Regards

Michael Barmuta

Staff Engineer

Fluke Corp.

Everett WA

425-446-6076



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve
Kelly
Sent: Thursday, May 25, 2006 7:17 AM
To: [log in to unmask]
Subject: [TN] Copper plating question

Good Day To All,
I have a copper plating distribution question. Is it
possible to hold
the
pattern copper plating thickness to +/-.0002 across a
panel. Anyone want
to
venture what kind of Cp and Cpk they might hold? Thanks in
advance.
Steve
Kelly

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