Hello,

I am trying to learn more about PCB farbciation process and would like to start with the plating requirement. I hope to find some replies to the following questions :

1. What is the best plating thickness for the various finished surface plating : 
a. electroless copper
b. tin-lead (HASL)
c. Nickel
d. Gold

2. In IPC 6012 Section 3.2.6 Metallic Platings and Coatings : What is the difference between Tin-Lead and Solder Coating?

3. What is the impact of too thin and too thick nickel and gold finishing thickness? If I request for for 3um nickel with 1.5um gold finish, is this combination OK for conductor trace and solder pad?

Thanks in advance and regards,
Wee Mei


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