Look like we have a copper day today.  Here is my question:  what is the
surface finishing spec for copper pads (wire bonding pad with Ni/Au on
them)?  I got extremely rough surface (look like sand blast surface) on my 2
layer substrate (1/2 oz on top and bottom).  I have not seen such a rough
surface on the outter layer before, prepeg may be, not the surface
layer....Sure enough, I did not put restriction on the dwg note regarding
the surface roughness until I saw this puppy...Any spec or smart note I can
put on to prevent this?  Thanks... (IPC standard gurus, any good clause
hidden in 20xx/60xx/70xx I can use?) Many thanks in advance.
Best regards,
                            jk

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