Hi Steve: Well; it depends...........

First: I'm going to assume you are using inches as the units for
thickness.
Second: You are not concerned about the uniformity of plating in the
holes vs. surface.

With that said the +/-0.0002 can be done but there are many factors that
will influence it:

*       Design
*       Panel size
*       Outer-layer circuit layout
*       Uniformity of layout across the panel
*       Plating robbers
*       Plating thickness

*       Process
*       Rectification
*       Current density
*       Plating time
*       Anode distribution
*       Anode/cathode ratio
*       Anode maintenance
*       Plating rack material/design/attachment
*       Plating bath agitation
*       Plating tank size/design
*       Plating bath chemistry
*       Plating bath maintenance

        There are other factors but you get the idea. The goal is to
create a uniform current distribution across the panel.

                                                        	
	
Regards
	
Michael Barmuta
	
Staff Engineer
	
Fluke Corp.
	
Everett WA
	
425-446-6076



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Kelly
Sent: Thursday, May 25, 2006 7:17 AM
To: [log in to unmask]
Subject: [TN] Copper plating question

Good Day To All,
I have a copper plating distribution question. Is it possible to hold
the
pattern copper plating thickness to +/-.0002 across a panel. Anyone want
to
venture what kind of Cp and Cpk they might hold? Thanks in advance.
Steve
Kelly

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------


This message (including any attachments) contains confidential
and/or proprietary information intended only for the addressee.
Any unauthorized disclosure, copying, distribution or reliance on
the contents of this information is strictly prohibited and may
constitute a violation of law.  If you are not the intended
recipient, please notify the sender immediately by responding to
this e-mail, and delete the message from your system.  If you
have any questions about this e-mail please notify the sender

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
immediately.