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May 2006

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Subject:
From:
R Sedlak <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, R Sedlak <[log in to unmask]>
Date:
Wed, 24 May 2006 15:26:05 -0700
Content-Type:
text/plain
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text/plain (75 lines)
Cheryl:

Plating from solutions involves transfering electrons to ions floating in solution, converting them to metals, hopefully on the surface we want.

There are three kinds of plating from solutions...
immersion plating
electroless plating
electrolytic plating

The three different methods differ in the source of the electrons...

In immersion plating, some of the substrate dissolves, releasing electrons, which cause the metal in solution to plate out.   This kind of plating is self-limiting, when the substrate material gets covered, plating stops.  This is why you cannot get gold over about 0.25 micron in IMMERSION gold.

In electroless plating, another chemical in solution donates electrons to the metal ions in solution, causing them to plate out.   There is theoretically no limit to the thickness you can achieve using electroless plating... thus achieving 0.5 micron gold can be done with ELECTROLESS gold.

And for the record, the rectifier, also known as the "electron pump", pumps electrons from the anode to the cathode in electrolytic plating.

Rudy Sedlak
RD Chemical Company

Cheryl Johnson <[log in to unmask]> wrote: I believe I have seen this somewhere, and have tried searching the archives,
but am having trouble finding it.

Does anyone know of any processes for electroless gold that can obtain > .5
micron thickness (without needing bus bars?)
Or any way to get > .5 micron gold on a flex without bus bars?

Thank you!

Sincerely,

-----------------------------------

Cheryl Johnson, C.I.D.+

Manager

ExcelStor US Office, Engineering Services

Email: [log in to unmask]

Tel: (303) 684-7291

Fax: (303) 684-7268

Mobile: (303) 809-5815

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