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May 2006

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Subject:
From:
Lee parker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lee parker <[log in to unmask]>
Date:
Wed, 24 May 2006 17:14:21 -0400
Content-Type:
text/plain
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text/plain (138 lines)
Joe


I am referring to the amount of silver that is plated onto the pad. Some
very smart folks that I use to work with once explained to me that the
reason electrolytic silver is prone to migrate while immersion silver does
not is the amount of silver plated to a pad. There appears to  be a
threshold which when exceeded promotes migration. I have never seen a
quantitative analysis of where this takes place, but it appears to be well
above the thickness of typical immersion silver.

Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389


----- Original Message -----
From: "Joe Russeau" <[log in to unmask]>
To: "TechNet E-Mail Forum" <[log in to unmask]>; "Lee Parker" <[log in to unmask]>
Sent: Wednesday, May 24, 2006 5:05 PM
Subject: Re: [TN] Electrolytic Ag Suppliers for COB applications


> Hi Lee,
>
> Forgive my ignorance, but could you please explain what you mean by the
> statement "silver inventory is increased many times over"?  Are you
> meaning
> that the deposition thickness of electrolytic silver is higher than that
> found for immersion silver thereby allowing for an increased risk of metal
> migration?
>
> Best regards,
>
> Joe Russeau
>
>
> ----- Original Message -----
> From: "Lee Parker" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Wednesday, May 24, 2006 3:21 PM
> Subject: Re: [TN] Electrolytic Ag Suppliers for COB applications
>
>
> > Steven
> >
> > I would be careful about electrolytic silver in electronic applications.
> > While this has not been a problem with immersion silver there have been
> > problems with silver migration using electrolytic silver. Most likely,
> > because the silver inventory is increase many times over.
> >
> > Best regards
> >
> > Lee
> >
> > J. L. Parker Ph.D.
> > JLP Consultants LLC
> > (804) 779 3389
> >
> >
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]] On Behalf Of Creswick, Steven
> > Sent: Wednesday, May 24, 2006 3:00 PM
> > To: [log in to unmask]
> > Subject: [TN] Electrolytic Ag Suppliers for COB applications
> >
> > All,
> >
> > I do not wish to get any plating bath suppliers in trouble by responding
> > to the forum at large [and come across as selling themselves], but if
> > there is anyone lurking out there in the bushes that knows of a plating
> > bath supplier selling electrolytic Ag for gold wire bonding
> > applications, please contact me directly.  I am speaking of automotive
> > type quantities, but can not really get into the application.
> >
> > The underlying nickel could be electroless or electrolytic.
> >
> > Would like US and overseas users of said bath/s if possible.
> >
> > Have checked the archives, but did not locate appropriate info
> >
> >
> > Steven Creswick
> > Gentex Corporation
> > 616 772 1590 x846
> >
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