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May 2006

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Subject:
From:
Lee parker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lee parker <[log in to unmask]>
Date:
Wed, 24 May 2006 14:48:49 -0400
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text/plain
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text/plain (81 lines)
Cheryl

Electroless plating usually implies a catalytic process, as opposed to
immersion. With a catalytic process any thickness is theoretically
obtainable provided there are no restrictions on the plating time. Half a
micron can in theory be obtained on most electroless gold process, but the
time involved will normally be prohibitive.

Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389


----- Original Message -----
From: "Cheryl Johnson" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, May 24, 2006 1:43 PM
Subject: [TN] electroless gold thickness'


> I believe I have seen this somewhere, and have tried searching the
> archives,
> but am having trouble finding it.
>
> Does anyone know of any processes for electroless gold that can obtain >
> .5
> micron thickness (without needing bus bars?)
> Or any way to get > .5 micron gold on a flex without bus bars?
>
> Thank you!
>
> Sincerely,
>
> -----------------------------------
>
> Cheryl Johnson, C.I.D.+
>
> Manager
>
> ExcelStor US Office, Engineering Services
>
> Email: [log in to unmask]
>
> Tel: (303) 684-7291
>
> Fax: (303) 684-7268
>
> Mobile: (303) 809-5815
>
> -----------------------------------
>
>
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