Dear All,

Is the plating process deifferent for IC package substrate ?

Regards
Suganthi,CID



Werner Engelmaier <[log in to unmask]>
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05/19/2006 05:27 PM
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Re: [TN] Plating process






Hi Suganthi,
Well, for some PCBs there is also a Ni overplate.
Basically, the processes after drilling the hole are:
1) desmear [either chemically or by plasma etching];
2) catalysation;
3) electroless Cu flash;
4) electrolytic Cu plate,
with rinse/wask steps in between.
The Cu flash is required for electrical continuity for the electrolytic
plating., which is carried out, very basically in an acid solution with
the PCB as
cathode between Cu-anodes from which the plating process removes Cu in ion
form which move in the solution to the PCB and deposit as Cu-plating.
The plating current density determines the rate of plating, additives
determine how fast you can plate and still get Cu-plating with good
physical
properties. This is it in an nutshell--in practice things get more
complicated.



Werner

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