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May 2006

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Subject:
Re: Plating process
From:
Selva Suganthi <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 19 May 2006 16:54:02 +0530
Content-Type:
text/plain
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text/plain (85 lines) 
Dear Fritz and all,

yes . I am talking about copper in the through hole only.

I hope the common material is copper  in the through holes in the  board ?
(Correct me If I am wrong!! )


Thanks and Regards
Suganthi,CID
"Do not go where the path may Lead, Go instead where there is no path, and
leave a trail ! "



Dennis  Fritz <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
05/19/2006 04:42 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
[log in to unmask]


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Subject
Re: [TN] Plating process






In a message dated 5/19/2006 6:09:56 AM Eastern Daylight Time,
[log in to unmask] writes:

How is  the plating process done in PCB fabrication ? pls help me  to
understand


Suganthi,

I am afraid that more than one metal is plated in PCB  fabrication -
copper,
nickel, tin, silver, gold, solder eutectic.    And worse, there are three
ways
to plate - electrodeposition with DC current,  electroless with chemical
reduction, and immersion with metallic  replacement.

We need for you to be a bit more specific as to the metal  because several
of
these can be deposited by more than one technology,  above.  Are you
talking
about the copper in the through holes in the  board?

Denny Fritz
MacDermid, Inc.

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