Woah, Ioan,
I beg to differ. Tg is NOT almost thing of the past, it is just that other
properties have risen in imprtance.
As I indicated in an earlier response, I have developed a White Paper with
recommendations and their reasonings behind them on the specifications and 'FAB
Notes' for RoHS-compliant PCBs compatible with LF-soldering temperatures.
It addresses those questions.
Werner
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