In a message dated 5/16/06 12:48:44, [log in to unmask] writes:
> Any concerns yet amongst this group regarding planar microvoids and
> immersion silver?
> http://www.smta.org/files/oregon_chapter_presentation0905.pdf
> 
Hi John,
Planar microvoids are indeed a reliability issue. Their connection to ImAg 
has been shown to require what was termed "the perfect storm" of a rather 
contrived combination of parameters. [ See Engelmaier, W., “Voids in Solder Joints—
Reliability,” Global SMT & Packaging, Vol. 6, No. 1 [EU Edition], December 
2005/January 2006, pp. 44-45 & Cullen, Donald P., “Avoiding Microvoids,” 
Assembly, September 2005.]

Werner

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