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May 2006

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Subject:
From:
"Kane, Amol (349)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kane, Amol (349)
Date:
Mon, 1 May 2006 10:54:37 -0400
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IPC/JEDEC J-STD-033B deals with handling, Packing, shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
IPC 4553 deals with Specification for Immersion Silver Plating for Printed Circuit Boards

IPC also has specifications for Immersion Tin

Amol Kane
M.S (Industrial Eng.)
Process Engineer
Harvard Custom Manufacturing 
941 Route 38  Owego, NY 13827
Phone: (607) 687-7669 x349
[log in to unmask]
www.harvardgrp.com

 -----Original Message-----
From:   TechNet [mailto:[log in to unmask]]  On Behalf Of Franklin D Asbell
Sent:   Monday, May 01, 2006 10:16 AM
To:     [log in to unmask]
Subject:        [TN] IPC handling-packaging specifications

I heard someone recently comment that IPC has a handling and packaging
specification. I've not heard of such a document, is there one? And what
number would it be.



Also, is there a specification for immersion silver? Any feedback would be
appreciated.



Franklin D Asbell

1311 Carnation Drive

Lewisville, Texas 75067

972-221-1178 - home

214-682-5625 - cellular




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Technet Mail List provided as a service by IPC using LISTSERV 1.8e
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To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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