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May 2006

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Subject:
From:
Steve Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Gregory <[log in to unmask]>
Date:
Tue, 16 May 2006 07:45:09 -0500
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text/plain
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text/plain (56 lines)
Mornin' Kevin!

Are the vias supposed to be tented? If so, are they tented on one side
or both? You should expect the same sort adhesion over vias...could be
there's contamination that wasn't cleaned well prior to masking.

-Steve Gregory- 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kevin Glidden
Sent: Tuesday, May 16, 2006 7:31 AM
To: [log in to unmask]
Subject: [TN] Soldermask adhesion over vias?

Can I / should I expect the same level of soldermask adhesion over vias
as over the copper plane or laminate?  I have PCBs that have poor
adhesion of soldermask over the via pads, but acceptable everywhere
else.  Many vias are now bare copper, and the vias that are covered
easily fail any tape adhesion test.

How should I specify adhesion requirements on a drawing?  IPC-SM-840?

Thanks,



Kevin Glidden
Manufacturing Engineer
Luminescent Systems Inc.




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