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May 2006

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Subject:
From:
George Milad <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 15 May 2006 15:14:44 EDT
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I believe one of the key issues in assembling ENIG parts is that the
inter-metallic formed is a Ni/Sn. Ni/Sn inter-metallic requires  higher  peak
assembly temperature and a longer dwell at peak temperature. The right  re-flow
temperature profile is a must.

The recommendation of ENIG assembly is 220 C for 20 seconds.

Some of the failures with ENIG may be attributed to colder assembly
temperatures.

The transition to Pb-Free should favor ENIG as the assembly temperature for
Pb-Free is going to be higher and the Ni/Sn inter-metallic will always be
formed  successfully.


Best  regards

George Milad
[log in to unmask]
National Accounts Manager  for Technology
Uyemura International Corporation
Technical Center
240  Town LIne Rd
Southington CT 06489
(516) 901 3874 (mobile)
(860)  793-4011 (office)
(860) 793-4020 (fax)

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